| Number | Content | Specification Parameters |
|---|---|---|
| 1 | Machine specifications | 650mm(W)×550mm(D)×450mm(H) |
| 2 | Vacuum Chamber Specifications | Imported aluminum 200(W)×200(H)×250(D)mm,10L |
| 3 | Electrode Specifications | Special aluminum electrode 150(L)×150(W)mm |
| 4 | Vacuum pump system | Mechanical rotary vane vacuum pump (external) |
| 5 | Vacuum measurement system | Pirani resistance vacuum gauge |
| 6 | Gas Metering System | Adjustable Rotameter |
| 7 | Number of gas channels | 2 way air intake, 1 way vent |
| 8 | Plasma generator | 40KHz, high frequency generator, 0-1000W adjustable |
| 9 | Working gas | 2 working gases are optional: Ar2, N2, H2, O2 |
| Features: High precision, fast response, good controllability and compatibility, complete functions and professional technical support. It is suitable for surface treatment and activation of small-sized products in university laboratories and semiconductor IC fields. Uses: Suitable for camera and industry, mobile phone manufacturing, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. 1. Camera and fingerprint identification industry: deoxidize the gold PAD surface of soft and hard board; IR surface cleaning and cleaning; 2. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before bonding and welding; 3. Silica gel, plastic, and polymer fields: surface roughening, etching, and activation of silica gel, plastic, and polymers. |
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